PolyMide™ CoPA

PolyMide™ is a family of Nylon/polyamide-based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.

PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.

Available Colors:
 
Black, Natural
Diameter Size:
 
1.75 mm, 2.85 mm
Net Weight:
 
750 g
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Print Settings
Nozzle Temperature:
250˚C – 270˚C
Printing Speed:
30mm/s – 60mm/s
Bed Temperature
25˚C – 50˚C
Bed Surface:
Glass with glue
Cooling Fan:
OFF
Mechanical Properties
Young's Modulus:
2223 ± 199 Mpa
Tensile Strength:
66.2 ± 0.9 Mpa
Elongation at Break:
Shore Hardness:
Bending Strength:
97.0 ± 1.1 Mpa
Charpy Impact:
9.6 ± 1.4 kJ/m2
Thermal Propertises
Glass Transition Temperature:
67˚C
Vicat Softening Temperature:
180˚C
Melting Temperature:
190˚C
Notes
Drying Settings:
100˚C for 8h
Recommended Support Materials
30mm/s – 60mm/s
Other:
25˚C – 50˚C

PolyMide™ CoPA features Polymaker's Warp-Free™ technology: Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.

Print Settings
Compatible Material:
Maximum Part Size (Diameter*Height):
Polishing Liquid:
Polishing Time:
Operating Temperature
Storage Temperature:
Power Supply (INPUT):
Power Supply (OUTPUT):
Polysher™ INPUT:
Desiccant Type:
Humidity Range:
Resolution
Response
Temperature Range:
Battery specifications
Operation Manual:
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PolyMide™ CoPA features Polymaker's Warp-Free™ technology: Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.